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      Hotsale single-component fast-curing epoxy bottom filling adhesive for post-assembly filling and protection of BGA/CSP

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      Xiamen Aibeisen Electronics Ltd1 yrCN
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      Key attributes

      Industry-specific attributes

      CAS No.
      7085-85-0

      Other attributes

      Place of Origin
      Fujian, China

      Main Raw Material
      Epoxy

      Usage
      Electronics

      Other Names
      bottom filling adhesive

      MF
      mixed

      EINECS No.
      230-391-5

      Classification
      Other Adhesives

      Brand Name
      APS

      Model Number
      HP23125B

      Colors
      Black

      Density
      1.09

      Vicosity
      3500

      Working Time
      7 days

      Storage Life
      6 months

      Packaging and delivery

      Packaging Details
      1.Packaging of thermal pad/ conductive pad / thermal interface pad
      Carton boxes size:270mm(L)*170mm(W)*40mm(H)
      Packaging Detalis:
      The normal package is carton box, if export quantities are too much, we will put the carton boxes on the planker, and then pack the whole planker up to transport.
      Port:Xiamen

      Selling Units:
      Single item

      Single package size:
      9.8X11.7X0.2 cm

      Single gross weight:
      0.020 kg

      Supply Ability

      Supply Ability
      250000 Piece/Pieces per Month

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      Lead time

      Quantity (pieces)1 - 500 > 500
      Lead time (days)5To be negotiated
      Still deciding? Get samples first! Order sample

      Samples

      Maximum order quantity: 1 piece
      Sample price:
      $20.00/piece
      Minimum order quantity: 80 pieces
      $18.30 - $19.50

      Quantity

      Shipping

      Shipping solutions for the selected quantity are currently unavailable
      Item subtotal (0 variations 0 items)
      $0.00
      Shipping total
      $0.00
      Subtotal
      $0.00
      Still deciding? Get samples first! Order sample

      Samples

      Maximum order quantity: 1 piece
      Sample price:
      $20.00/piece

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