Halogen-free underfills adhesive

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3 Piece/Pieces (Min. Order)
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Overview
Quick Details
CAS No.:
mixture
Place of Origin:
Fujian, China (Mainland)
Classification:
Other Adhesives
Main Raw Material:
Epoxy
Usage:
Packing, electronic underfill
Brand Name:
APS
Model Number:
HQ-124
Packaging & Delivery
Packaging Details
10mL, 30mL, 55mL tube
Port
xiamen
Lead Time :
5-15days

Specifications

1) Halogen-free underfills adhesive
2) Fast cure, reworkable
3) Low CTE, high reliability
4) two color choice

Halogen-free underfills adhesive

 

INTRODUCTION                                                               

 

HQ-124 is a one component, halogen free, epoxy adhesive designed for use as a reworkable underfill resin for CSP(FBGA) or BGA. It cures rapidly on exposure to heat. It is designed to give excellent protection from failure due to mechanical stress. The low viscosity allows filling in gaps under CSP or BGA.

 

Chemical Type

Epoxy

Appearance

opaque cream yellow liquid / Black liquid

Cure

Heat cure

Cure Benefit

Production - high speed curing

Application

Underfill

Specific Application

Reworkable underfill for CSP (FBGA) or BGA

Dispense Method

Syringe

Key Substrates

SMD components to PCB

 

MAIN FEATURES                                                               

1)      Halogen free

2)      Long pot life

3)      Two color choice

4)      Fast cure, reworkable

5)      Low CTE, high reliability

6)      Adjustable viscosity, excellent storability

 

UNCURED PROPERTIES                                                         

 

APS   HQ-124Y / HQ-124B

Appearance

HQ-124Y:   opaque cream yellow  liquid                        HQ-124B: Black liquid

Viscosity at 25°C / mPa

Adjustable viscosity: 600-2500

Density at 25°C / g/cm³

1.1-1.2

Cure condition

120°C*10min or 150°C*5min

Pot life at 25°C / days

30

shelf life at 0-5°C / months

6

Package

10mL, 30mL, 55mL tube

 

CURED PROPERTIES                                                           

 

APS   HQ-124Y / HQ-124B

Hardness (Shore D)

80

Density at 25°C (g/cm³)

1.13-1.23

Shrinkage (%)

2.5

Tg by TMA (°C)

50

Water absorption 25°C*24h (%)

0.2

Elongation at break (%)

3.6

Tensile strength (N/mm2)

20

Volume resistivity (ohm·cm)

4.6×1016

Surface resistivity (ohm)

1.4×1016